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专利名称：THREE-DIMENSIONAL INTEGRATED CIRCUIT
SYSTEMS IN A PACKAGE AND METHODSTHEREFOR
发明人：ZHIWEI GONG,SCOTT M. HAYES,MICHAEL B.
VINCENT
申请号：US14829820申请日：20150819
公开号：US20170053862A1公开日：20170223
专利附图：
摘要：A method for making a packaged semiconductor device includes dispensing a
first adhesive into a first cavity of a substrate having a first major surface and a secondmajor surface. The first cavity extends into the substrate from the second major surface.The method further includes placing a first component having a thickness less than athickness of the substrate into the first cavity such that the first adhesive physicallycontacts a first major surface of the first component and at least partially fills a gapbetween sidewalls of the first component and sidewalls of the first cavity. After placingthe first component, a second major surface of the first component is coplanar with thesecond major surface of the substrate.
申请人：FREESCALE SEMICONDUCTOR, INC.
地址：AUSTIN TX US
国籍：US
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